Red-Bull 11 月 1 日 上午 9:50
GigaByte B760 GAMING X DDR4
Good time of day. GigaByte B760 GAMING X DDR4 motherboard. I found shades of copper on the motherboard's power cells (If you can call them that, if I'm not mistaken) on the south and north bridges, near the soldering (Left and right) of this component, I'm sorry for the poor-quality photo, but it's barely visible in the photo. If you look closely, you'll see it. I doubt that this is rust or a trace of burnt, because the motherboard is working properly. Please tell me why there are glimpses of copper, and only on these two components on the entire motherboard. Does anyone know what these components are, what their role is, and if there is a defect in the photos? Thanks!
https://ibb.co/1GcD4D8W
https://ibb.co/4gn0jFCn
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smallcat 11 月 1 日 上午 10:07 
As long as there s no smell/smoke you re fine .
i found for the second photo - a voltage regulator up to 5A
Red-Bull 11 月 1 日 上午 10:22 
引用自 smallcat
As long as there s no smell/smoke you re fine .
i found for the second photo - a voltage regulator up to 5A
thanks
Carlsberg 11 月 1 日 上午 10:35 
引用自 LionGoodWay
Please tell me why there are glimpses of copper, and only on these two components on the entire motherboard. Does anyone know what these components are, what their role is, and if there is a defect in the photos? Thanks!

Copper is the m/board contact point which parts are soldered to. Nothing wrong, solder just does not cover whole mount point, it doesn't need to.
最后由 Carlsberg 编辑于; 11 月 1 日 上午 10:36
_I_ 11 月 1 日 下午 1:29 
thats just the pads where the solder mask did not cover when the board was baked

its fine and they are soldered in place
you can see the silver solder around the edge of the mosfets heatsink
Red-Bull 11 月 1 日 下午 2:35 
引用自 _I_
thats just the pads where the solder mask did not cover when the board was baked

its fine and they are soldered in place
you can see the silver solder around the edge of the mosfets heatsink
thank you very much
Red-Bull 11 月 2 日 上午 7:47 
引用自 _I_
thats just the pads where the solder mask did not cover when the board was baked

its fine and they are soldered in place
you can see the silver solder around the edge of the mosfets heatsink
https://ibb.co/f3pkwV6
https://ibb.co/PZ79Tmt9
https://ibb.co/3YB7FzG9
Sorry. And here are two more different components, but already on the asus 3060 graphics card. And here you can see the difference in the color of the solder, one component has a perfectly pronounced silver solder color on all sides. In another photo, for another component, one solder line has a more copper tint. But it's still a flash from the camera, bleached the solder color, but it still catches the eye. Is there a defect in this case?
最后由 Red-Bull 编辑于; 11 月 2 日 上午 7:59
_I_ 11 月 2 日 上午 8:33 
引用自 LionGoodWay
引用自 _I_
thats just the pads where the solder mask did not cover when the board was baked

its fine and they are soldered in place
you can see the silver solder around the edge of the mosfets heatsink
https://ibb.co/f3pkwV6
https://ibb.co/PZ79Tmt9
https://ibb.co/3YB7FzG9
Sorry. And here are two more different components, but already on the asus 3060 graphics card. And here you can see the difference in the color of the solder, one component has a perfectly pronounced silver solder color on all sides. In another photo, for another component, one solder line has a more copper tint. But it's still a flash from the camera, bleached the solder color, but it still catches the eye. Is there a defect in this case?
no

same thing
the mask didnt cover the entire pads before parts placed and baked

those pads are not tiny dots, they are rectangle, with some length under the chip
they dont take hardly any solder to connect to the board and are not the kind of connections to fail

bga on the other hand are known to crack, due to heat and stress because they float the component on solder balls/pads
slightly different sized balls form different shapes () vs )( to fill the gaps

anyhoo they are fine, im sure the board passed qc before leaving the factory


fun fact, some boards or pins are coated with gold, to help the solder bond to them, as gold melts at a lower temp than silver/lead/tin solder, and will mix with it and bond to the copper
Red-Bull 11 月 2 日 上午 8:43 
引用自 _I_
引用自 LionGoodWay
https://ibb.co/f3pkwV6
https://ibb.co/PZ79Tmt9
https://ibb.co/3YB7FzG9
Sorry. And here are two more different components, but already on the asus 3060 graphics card. And here you can see the difference in the color of the solder, one component has a perfectly pronounced silver solder color on all sides. In another photo, for another component, one solder line has a more copper tint. But it's still a flash from the camera, bleached the solder color, but it still catches the eye. Is there a defect in this case?
no

same thing
the mask didnt cover the entire pads before parts placed and baked

those pads are not tiny dots, they are rectangle, with some length under the chip
they dont take hardly any solder to connect to the board and are not the kind of connections to fail

bga on the other hand are known to crack, due to heat and stress because they float the component on solder balls/pads
slightly different sized balls form different shapes () vs )( to fill the gaps

anyhoo they are fine, im sure the board passed qc before leaving the factory


fun fact, some boards or pins are coated with gold, to help the solder bond to them, as gold melts at a lower temp than silver/lead/tin solder, and will mix with it and bond to the copper

well, judging by my photos, this is clearly not a gold coating, and never mind) and the fact is really interesting, it means that limited 4090-5090 in gold for sheikhs from the UAE, in addition to the case, they probably have gold solders on the xD board.
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